电路板朮语总整理
<SPAN class=font14 twffan="done"><A href="http://www.diguang.com/"></A><FONT size=2><FONT face=宋体><STRONG>电路板术语总整理</STRONG><BR> *****A*****<BR>Abietic Acid松脂酸.<BR>Abrasion Resistance耐磨性.<BR>Abrasives磨料,刷材.<BR>ABS树脂.<BR>Absorption吸收(入).<BR>Ac Impedance交流阻抗.<BR>Accelerated Test(Aging)加速老化(试验).<BR>Acceleration速化反应.<BR>Accelerator 加速剂,速化剂.<BR>Acceptability,Acceptance 允收性,允收.<BR>Access Hole露出孔,穿露孔.<BR>Accuracy准确度.<BR>Acid Number (Acid Value)酸值.<BR>Acoustic Microscope (AM)感音成像显微镜.<BR>Acrylic压克力(聚丙烯酸树脂).<BR>Actinic Light (or Intensity, or Radiation)有效光.<BR>Activation活化.<BR>Activator活化剂.<BR>Active Carbon活性炭.<BR>Active Parts(Devices)主动零件.<BR>Acutance解像锐利度.<BR>Addition Agent添加剂.<BR>Additive Process加成法.<BR>Adhesion附着力.<BR>Adhesion Promotor附着力促进剂.<BR>Adhesive胶类或接着剂.<BR>Admittance导纳(阻抗的倒数).<BR>Aerosol喷雾剂,气熔胶,气悬体.<BR>Aging老化.<BR>Air Inclusion气泡夹杂.<BR>Air Knife风刀.<BR>Algorithm算法.<BR>Aliphatic Solvent脂肪族溶剂.<BR>Aluminium Nitride(AlN)氮化铝.<BR>Ambient Tamp环境温度.<BR>Amorphous无定形,非晶形.<BR>Amp-Hour安培小时.<BR>Analog Circuit/Analog Signal模拟电路/模拟讯号.<BR>Anchoring Spurs着力爪.<BR>Angle of Contack接触角.<BR>Angle of Attack攻角.<BR>Anion阴离子.<BR>Anisotropic异向性,单向的.<BR>Anneal 韧化(退火).<BR>Annular Ring孔环.<BR>Anode阳极.<BR>Anode Sludge阳极泥.<BR>Anodizing阳极化.<BR>ANSI美国标准协会.<BR>Anti-Foaming Agent消泡剂.<BR>Anti-pit Agent抗凹剂.<BR>AOI自动光学检验.<BR>Apertures开口,钢版开口.<BR>AQL品质允收水准.<BR>AQL(Acceptable Quality Level)允收品质水准.<BR>Aramid Fiber聚醯胺纤维.<BR>Arc Resistance耐电弧性.<BR>Array排列.<BR>Artwork底片.<BR>ASIC特定用途绩体电路器.<BR>Aspect Ratio纵横比.<BR>Assembly组装装配.<BR>A-stage A阶段.<BR>ATE自动电测设备.<BR>Attenuation讯号衰减.<BR>Autoclave压力锅.<BR>Axial-lead轴心引脚.<BR>Azeotrope共沸混合液.<BR> *****B*****<BR>Back Light (Back Lighting)背光法.<BR>Back Taper反锥斜角.<BR>Backpanels, Backplanes支撑板.<BR>Back-up 垫板.<BR>Balanced Transmission Lines平衡式传输线.<BR>Ball Grid Array球脚数组(封装).<BR>Bandability弯曲性.<BR>Banking Agent护岸剂.<BR>Bare Chip Assembly裸体芯片组装.<BR>Barrel孔壁,滚镀.<BR>Base Material基材.<BR>Basic Grid基本方格.<BR>Batch批.<BR>Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr)<BR>凡液体比重比水轻则 Be=140÷(Sp.Gr-130)<BR>*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值).<BR>Beam lead光芒式的平行密集引脚.<BR>Bed-of-Nail Testing针床测试.<BR>Bellows Conact弹片式接触.<BR>Beta Ray Backscatter贝他射线反弹散射.<BR>Bevelling切斜边.<BR>Bias斜张纲布,斜纤法.<BR>Bi-Level Stencil]双阶式钢板.<BR>Binder粘结剂.<BR>Bits头(Drill Bits).<BR>Black Oxide黑氧化层.<BR>Blanking冲空断开.<BR>Bleack 漂洗.<BR>Bleeding溢流.<BR>Blind Via Hole肓通孔.<BR>Blister局部性分层或起泡.<BR>Block Diagram电路系统块图 .<BR>Blockout封纲.<BR>Blotting干印.<BR>Blotting Paper吸水纸.<BR>Blow Hole吹孔.<BR>Blue Plaque蓝纹(锡面钝化层).<BR>Blur Edge (Circle)模糊边带(圈).<BR>Bomb Sight弹标.<BR>Bond Strength结合强度.<BR>Bondability结合性.<BR>Bonding Layer结合层接着层.<BR>Bonding Sheet(Layer)接合片.<BR>Bonding Wire结合线.<BR>Bow, Bowing板弯.<BR>Braid编线.<BR>Brazing硬焊(用含银的铜锌合金焊条).<BR>在425℃~870℃下进行熔接的方式).<BR>Break Point显像点.<BR>Break-away Panel可断开板.<BR>Breakdown Voltage崩溃电压.<BR>Break-out破出.<BR>Bridging搭桥.<BR>Bright Dip光泽浸渍处理.<BR>Brightener光泽剂.<BR>Brown Oxide棕氧化.<BR>Brush Plating刷镀.<BR>B-stageB阶段.<BR>Build Up Process增层法制程.<BR>Build-up堆积.<BR>Bulge鼓起.<BR>Bump 突块.<BR>Bumping Process凸块制程.<BR>Buoyancy浮力.<BR>Buried Via Hole埋导孔.<BR>Burn-in高温加速老化试验.<BR>Burning烧焦.<BR>Burr毛头.<BR>Bus Bar汇电杆.<BR>Butter Coat 外表树脂层.<BR> *****C*****<BR>C4 Chip JointC4芯片焊接.<BR>Cable电缆.<BR>CAD计算机辅助设计.<BR>Calendered Fabric轧平式纲布.<BR>Cap Lamination帽式压合法.<BR>Capacitance电容.<BR>Capacitive Coupling电容耦合.<BR>Capillary Action毛细作用.<BR>Carbide碳化物.<BR>Carbon Arc Lamp碳弧灯.<BR>Carbon Treatment, Active活化炭处理.<BR>Card卡板.<BR>Card Cages/Card Racks电路板构装箱.<BR>Carlson Pin卡氏定位稍.<BR>Carrier载体.<BR>Cartridge滤心.<BR>Castallation堡型绩体电路器.<BR>Catalyzed Board, Catalyzed Substrate催化板材.<BR>Catalyzing催化.<BR>Cathode阴极.<BR>Cation阴向离子, 阳离子.<BR>Caul Plate隔板.<BR>Cavitation空泡化 半真空.<BR>Center-to-Center Spacing中心间距.<BR>Ceramics陶瓷.<BR>Cermet陶金粉.<BR>Certificate证明书.<BR>CFC氟氢碳化物.<BR>Chamfer倒角.<BR>Characteristic Impedance特性阻抗.<BR>Chase纲框.<BR>Check List检查清单.<BR>Chelate螯合.<BR>Chemical Milling化学研磨.<BR>Chemical Resistance抗化性.<BR>Chemisorption化学吸附.<BR>Chip芯片(粒).<BR>Chip Interconnection芯片互连.<BR>Chip on Board芯片粘着板.<BR>Chip On Glass晶玻接装(COG).<BR>Chisel钻针的尖部.<BR>Chlorinated Solvent含氯溶剂,氯化溶剂.<BR>Circumferential Separation环状断孔.<BR>Clad/Cladding披覆.<BR>Clean Room无尘室.<BR>Cleanliness清洁度.<BR>Clearance余地,余环.<BR>Clinched Lead Terminal紧箝式引脚.<BR>Clinched-wire Through Connection通孔弯线连接法 .<BR>Clip Terminal绕线端接.<BR>Coat, Coating皮膜表层.<BR>Coaxial Cable同轴缆线.<BR>Coefficient of Thermal Expansion热膨胀系数.<BR>Co-Firing共绕.<BR>Cold Flow冷流.<BR>Cold Solder Joint冷焊点.<BR>Collimated Light平行光.<BR>Colloid胶体.<BR>Columnar Structure柱状组织.<BR>Comb Pattern梳型电路.<BR>Complex Ion错离子.<BR>Component Hole零件孔.<BR>Component Orientation零件方向.<BR>Component Side组件面.<BR>Composites,(CEM-1,CEM-3)复合板材.<BR>Condensation Soldering凝热焊接,液化放热焊接.<BR>Conditioning整孔.<BR>Conductance导电.<BR>Conductive Salt导电盐.<BR>Conductivity导电度.<BR>Conductor Spacing导体间距.<BR>Conformal Coating贴护层.<BR>Conformity吻合性, 服贴性.</FONT></FONT></SPAN> Connector连接器.<BR>Contact Angle接触角.<BR>Contact Area接触区.<BR>Contact Resistance接触电阻.<BR>Continuity连通性.<BR>Contract Service协力厂,分包厂.<BR>Controlled Depth Drilling定深钻孔.<BR>Conversion Coating 转化皮膜.<BR>Coplanarity共面性.<BR>Copolymer共聚物.<BR>Copper Foil铜皮.<BR>Copper Mirror Test铜镜试验.<BR>Copper Paste铜膏.<BR>Copper-Invar-Copper (CIC)综合夹心板.<BR>Core Material内层板材,核材.<BR>Corner Crack 通孔断角.<BR>Corner Mark板角标记.<BR>Counterboring方型扩孔.<BR>Countersinking锥型扩孔.<BR>Coupling Agent 偶合剂.<BR>Coupon, Test Coupon板边试样.<BR>Coverlay/Covercoat表护层.<BR>Crack裂痕.<BR>Crazing白斑.<BR>Crease皱折.<BR>Creep潜变.<BR>Crossection Area截面积.<BR>Crosshatch Testing十字割痕试验.<BR>Crosshatching十字交叉区.<BR>Crosslinking, Crosslinkage交联,架桥.<BR>Crossover越交,搭交.<BR>Crosstalk噪声, 串讯.<BR>Crystalline Melting Point晶体熔点.<BR>C-Stage C阶段.<BR>Cure硬化,熟化.<BR>Current Density电流密度.<BR>Current-Carrying Capability载流能力.<BR>Curtain Coating濂涂法.<BR> *****D*****<BR>Daisy Chained Design菊瓣设计.<BR>Datum Reference基准参考.<BR>Daughter Board子板.<BR>Debris碎屑,残材.<BR>Deburring去毛头.<BR>Declination Angle斜射角.<BR>Definition边缘逼真度.<BR>Degradation 劣化.<BR>Degrasing脱脂.<BR>Deionized Water去离子水.<BR>Delamination分离.<BR>Dendritic Growth 枝状生长.<BR>Denier丹尼尔(是编织纺织所用各种纱类直径单位,<BR>定义9000米纱束所具有的重量(以克米计)).<BR>Densitomer透光度计.<BR>Dent凹陷.<BR>Deposition 皮膜处理.<BR>Desiccator干燥器.<BR>Desmearing去胶渣.<BR>Desoldering解焊.<BR>Developer显像液,显像机.<BR>Developing显像 .<BR>Deviation偏差.<BR>Device电子组件.<BR>Dewetting缩锡.<BR>D-glassD玻璃.<BR>Diaze Film偶氮棕片.<BR>Dichromate重铬 酸盐.<BR>Dicing芯片分割.<BR>Dicyandiamide(Dicy)双氰胺.<BR>Die 冲模.<BR>Die Attach晶粒安装.<BR>Die Bonding晶粒接着.<BR>Die Stamping冲压.<BR>Dielectric 介质.<BR>Dielectric Breakdown Voltage介质崩溃电压.<BR>Dielectric Constant介质常数.<BR>Dielectric Strength介质强度.<BR>Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法.<BR>Diffusion Layer扩散层.<BR>Digitizing数字化.<BR>Dihedral Angle双反斜角.<BR>Dimensional Stability尺度安定性.<BR>Diode二极管.<BR>Dip Coating浸涂法.<BR>Dip Soldering浸焊法.<BR>DIP(Dual Inline Package)双排脚封装体.<BR>Dipole偶极,双极.<BR>Direct / Indirect Stencil直接/间接版膜.<BR>Direct Emulsion直接乳胶.<BR>Direct Plating直接电镀.<BR>Discrete Compenent散装零件.<BR>Discrete Wiring Board散线电路板,复线板.<BR>Dish Down碟型下陷.<BR>Dispersant分散剂.<BR>Dissipation Factor散失因素.<BR>Disspation Factor散逸因子.<BR>Disturbed Joint受扰焊点.<BR>Doctor Blade修平刀,刮平刀.<BR>Dog Ear狗耳.<BR>Doping掺杂.<BR>Double Layer双电层.<BR>Double Treated Foil双面处理铜箔.<BR>Drag In / Drag Out带[进/带出.<BR>Drag Soldering拖焊.<BR>Drawbridging吊桥效应.<BR>Drift漂移.<BR>Drill Facet钻尖切削面.<BR>Drill Pointer钻针重磨机.<BR>Drilled Blank已钻孔的裸板.<BR>Dross浮渣.<BR>Drum Side铜箔光面.<BR>Dry Film干膜.<BR>Dual Wave Soldering 双波焊接.<BR>Ductility展性.<BR>Dummy Land假焊垫.<BR>Dummy, Dummying假镀(片).<BR>Durometer橡胶硬度计.<BR>DYCOstrate电浆蚀孔增层法.<BR>Dynamic Flex(FPC)动态软板.<BR> *****E*****<BR>E-Beam (Electron Beam)电子束.<BR>Eddy Current涡电流.<BR>Edge Spacing板边空地.<BR>Edge-Board Connector板边(金手指)承接器.<BR>Edge-Board Contact板边金手指.<BR>Edge-Dip Solderability Test板边焊锡性测试.<BR>EDTA乙二胺四乙酸.<BR>Effluent排放物.<BR>E-glass电子级玻璃.<BR>Elastomer弹性体.<BR>Electric Strength(耐)电性强度.<BR>Electrodeposition电镀.<BR>Electro-deposition Photoresist电着光阻, 电泳光阻.<BR>Electroforming电铸.<BR>Electroless-Deposition无电镀.<BR>Electrolytic Tough Pitch电解铜..<BR>Electrolytic-Cleaning电解清洗.<BR>Electro-migration电迁移.<BR>Electro-phoresis电泳动, 电渗.<BR>Electro-tinning镀锡.<BR>Electro-Winning电解冶炼.<BR>Elongation 延伸性, 延伸率.<BR>Embossing凸出性压花.<BR>EMF(Electromotive Force)电动势.<BR>EMI(Electromagnetic Interference)电磁干扰.<BR>Emulsion乳化.<BR>Emulsion Side药膜面.<BR>Encapsulating胶囊.<BR>Encroachment沾污,侵犯.<BR>End Tap封头.<BR>Entek有机护铜处理.<BR>Entrapment夹杂物.<BR>Entry Material盖板.<BR>Epoxy Resin环氧树脂.<BR>Etch Factor蚀刻因子.<BR>Etchant蚀刻剂(液).<BR>Etchback回蚀.<BR>Etching Indicator蚀刻指针.<BR>Etching Resist蚀刻阻剂.<BR>Eutetic Composition共融组成.<BR>Exotherm放热(曲线).<BR>Exposure曝光.<BR>Eyelet铆眼.<BR> *****F*****<BR>Fabric纲布.<BR>Face Bonding反面朝下结合.<BR>Failure故障.<BR>Fan Out Wiring/Fan In Wiring扇出布线/扇入布线.<BR>Farad 法拉.<BR>Farady法拉第.<BR>Fatigue Strength抗疲劳强度.<BR>Fault缺陷.<BR>Fault Plane断层面.<BR>Feed Through Hole导通孔.<BR>Feeder 进料器.<BR>Fiber Exposure玻纤显露.<BR>Fiducial Mark基准记号.<BR>Filament纤丝.<BR>Fill纬向.<BR>Filler填充料.<BR>Fillet内圆填角.<BR>Film底片.<BR>Film Adhesive接着膜,粘合膜.<BR>Filter过滤器.<BR>Fine Line细线.<BR>Fine Pitch密脚距,密线距,密垫距.<BR>Fineness粒度, 纯度.<BR>Finger手指.<BR>Finishing终修(饰).<BR>Finite Element Method有限要素分析法.<BR>First Article首产品.<BR>First Pass-Yield初检良品率.<BR>Fixture夹具.<BR>Flair刃角变形.<BR>Flame Point自燃点.<BR>Flame Resistant耐燃性.<BR>Flammability Rate燃性等级.<BR>Flare扇形崩口.<BR>Flash Plating闪镀.<BR>Flashover闪络.<BR>Flat Cable扁平排线.<BR>Flat Pack扁平封装(之零件).<BR>Flatness平坦度.<BR>Flexible Printed Circuit (FPC)软板.<BR>Flexural Failure挠曲损坏.<BR>Flexural Module弯曲模数, 抗挠性模数 .<BR>Flexural Strength抗挠强度.<BR>Flip Chip覆晶,扣晶.<BR>Flocculation絮凝.<BR>Flood Stroke Print覆墨冲程印刷.<BR>Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.<BR>Flurocarbon Resin碳氟树脂.<BR>Flush Conductor嵌入式线路 , 贴平式 导体.<BR>Flush Point闪火点.<BR>Flute退屑槽.<BR>Flux助焊剂.<BR>Foil Burr铜箔毛边.<BR>Foil Lamination铜箔压板法.<BR>Foot残足(干膜残余物).<BR>Foot Print (Land Pattern)脚垫.<BR>Foreign Material 外来物,异物.<BR>Form-to-List布线说明清单.<BR>Four Point Twisting四点扭曲法.<BR>Free Radical自由基.<BR>Freeboard干舷.<BR>Frequency频率.<BR>Frit 玻璃熔料.<BR>Fully-Additive Process全加成法.<BR>Fungus Resistance抗霉性.<BR>Fused Coating熔锡层.<BR>Fusing熔合.<BR>Fusing Fluid助熔液.<BR> *****G*****<BR>G-10由连续玻纤所织成的玻纤布与<BR>环氧树脂粘结剂所复合成的材料.<BR>Gage, Gauge量规.<BR>Gallium Arsenide (GaAs)砷化镓.<BR>Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).<BR>Galvanic Series贾凡尼次序(电动次序).<BR>Galvanizing镀锌.<BR>GAP第一面分离,长刃断开.<BR>Gate Array闸列,闸极数组.<BR>Gel Time胶化时间.<BR>Gelation Particle胶凝点.<BR>Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路<BR>图形与孔位,所发展一系列完整的软件档案).<BR>Ghost Image阴影.<BR>Gilding镀金 (现为:Glod Plating).<BR>Glass Fiber玻纤.<BR>Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.<BR>Glass Transition Temperature, Tg玻璃态转化温度.<BR>Glaze釉面,釉料.<BR>Glob Top圆顶封装体.<BR>Glouble Test球状测试法.<BR>Glycol (Ethylene Glycol)乙二醇.<BR>Golden Board测试用标准板.<BR>Grain Size结晶粒度.<BR>Grass Leak 大漏.<BR>Grid标准格.<BR>Ground Plane /Earth Plane接地层.<BR>Ground Plane Clearance接地空环.<BR>Guide Pin导针.<BR>Gull /Wing Lead鸥翼引脚.<BR> *****H*****<BR>Halation环晕.<BR>Half Angle半角.<BR>Halide卤化物.<BR>Haloing白圈,白边.<BR>Halon海龙,是CFC"氟碳化物"的一种商品名.<BR>Hard Anodizing硬阳极化.<BR>Hard Chrome Plating镀硬铬.<BR>Hard Soldering硬焊.<BR>Hardener (Curing Agent)硬化剂(或Curing Agent).<BR>Hardness硬度.<BR>Haring-Blum Cell海固槽.<BR>Harness电缆组合.<BR>Hay Wire跳线.<BR>Heat Cleaning烧洁.<BR>Heat Dissipation散热.<BR>Heat Distortion Point (Temp)热变形点(温度).<BR>Heat Sealing热封.<BR>Heat Sink Plane散热层.<BR>Heat Transfer Paste导热膏.<BR>Heatsink Tool散热工具.<BR>Hertz(Hz)赫.<BR>High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.<BR>Hipot Test 高压电测.<BR>Hi-Rel高度靠度.<BR>Hit 击(钻孔时钻针每一次"刺下"的动作).<BR>Holding Time停置时间.<BR>Hole Breakout孔位破出.<BR>Hole Counter数孔机.<BR>Hole Density孔数密度.<BR>Hole Preparation通孔准备.<BR>Hole Pull Strength孔壁强度.<BR>Hole Void破洞.<BR>Hook 切削刀缘外凸.<BR>Hot Air Levelling喷锡.<BR>Hot Bar Soldering热把焊接.<BR>Hot Gas Soldering热风手焊.<BR>HTE(High Temperature Elongation)高温延伸性.<BR>Hull Cell哈氏槽.<BR>Hybrid Integrated Circuit混成电路.<BR>Hydraulic Bulge Test液压鼓起试验.<BR>Hydrogen Embrittlement氢脆.<BR>Hydrogen Overvoltage氢过(超)电压.<BR>Hydrolysis水解.<BR>Hydrophilic亲水性.<BR>Hygroscopic吸湿性.<BR>Hypersorption超吸咐.<BR> *****I*****<BR>I.C. Socket绩体电路器插座.<BR>Icicle锡尖.<BR>Illuminance照度.<BR>Image Transfer影像转移.<BR>Immersion Plating浸镀.<BR>Impedance阻抗.<BR>Impedance Match阻抗匹配.<BR>Impregnate含浸.<BR>In-Circuit Testing组装板电测.<BR>Inclusion异物,夹杂物.<BR>Indexing Hole基准孔.<BR>Inductance(L)电感.<BR>Infrared(IR)红外线.<BR>Input/Output输入/输出.<BR>Insert, Insertion插接.<BR>Inspection Overlay套检底片.<BR>Insulation Resistance绝缘电阻.<BR>Integrated Circuit(IC)绩体电路器.<BR>Inter Face接口.<BR>Interconnection互连.<BR>Intermetallic Compound (IMC)接口共化物.<BR>Internal Stress内应力.<BR>Interposer互边导电物.<BR>Interstitial Via-Hole(IVH)局部层间导通孔.<BR>Invar殷钢(63.8%Fe,36%Ni,0.2%C).<BR>Ion Cleanliness离子清洁度.<BR>Ion Exchange Resins离子交换树脂.<BR>Ion Migration离子迁移.<BR>Ionizable (Ionic) Contaimination离子性污染.<BR>Ionization游离,电离.<BR>Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其<BR>电离所施加之最小电压).<BR>IPC美国印刷电路板协会.<BR>Isolation隔离性,隔绝性.<BR> *****J*****<BR>JEDEC(Joint Electronic Device 联合电子组件工程委员会.<BR>Engineering Council)<BR>J-LeadJ型接脚.<BR>Job Shop专业工厂.<BR>Joule焦耳.<BR>Jumper Wire跳线.<BR>Junction接(合)面,接头.<BR>Just-In-Time(JIT)适时供应,及时出现.<BR> *****K*****<BR>Kapton聚亚醯胺软板.<BR>Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为<BR>100%的钝金.<BR>Kauri-Butanol Value考立丁醇值(简称K.B.值).<BR>Kerf.切形,裁剪.<BR>Kevlar聚醯胺纤维.<BR>Key电键<BR>Key Board键盘.<BR>Kiss Pressure吻压, 低压.<BR>Knoop Hardness努普硬度.<BR>Known Good Die(KGD)已知之良好芯片.<BR>Kovar科伐合金(Fe53%,Ni29%,Co17%).<BR>Kraft Paper牛皮纸.<BR> *****L*****<BR>Lamda Wave延伸平波.<BR>Laminar Flow平流.<BR>Laminar Structure片状结构.<BR>Laminate Void板材空洞.<BR>Laminate(s)基板.<BR>Lamination Void压合空洞.<BR>Laminator压膜机.<BR>Land孔环焊垫,表面焊垫.<BR>Landless Hole无环通孔.<BR>Laser Direct Imaging (LDI)雷射直接成像.<BR>Laser Maching雷射加工法.<BR>Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.<BR>Laser Soldering雷射焊接法.<BR>Lay Back 刃角磨损. Lay Out布线,布局.<BR>Lay Up 叠合.<BR>Layer to Layer Spacing层间距离<BR>Leaching焊散漂出,熔出.<BR>Lead 引脚.<BR>Lead Frame脚架.<BR>Lead Pitch脚距.<BR>Leakage Current漏电电流.<BR>Legend文字标记.<BR>Leveling整平.<BR>Lifted Land孔环(焊垫)浮起.<BR>Ligand错离子附属体.<BR>Light Emitting Diodes (LED)发光二极管.<BR>Light Integrator光能累积器.<BR>Light Intensity光强度.<BR>Limiting Current Density极限电流密度.<BR>Liquid Crystal Display (LCD)液晶显示器.<BR>Liquid Dielectrics液态介质.<BR>Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.<BR>Local Area Network区域性网络.<BR>Logic 逻辑.<BR>Logic Circuit 逻辑电路.<BR>Loss Factor损失因素.<BR>Loss Tangent (TanδDK)损失正切.<BR>Lot Size批量.<BR>Luminance发光强度.<BR>Lyophilic亲水性胶体.<BR> *****M*****<BR>Macro-Throwing Power巨观分布力.<BR>Major Defect主要(严重)缺点.<BR>Major Weave Direction主要织向.<BR>Margin刃带(钻头尖部).<BR>Marking标记.<BR>Mask阻剂.<BR>Mass Finishing大量整面(拋光).<BR>Mass Lamination大型压板.<BR>Mass Transport质量输送.<BR>Master Drawing主图.<BR>Mat席(用于CEM-3(Composite Epoxy Material)的<BR>复合材料.)<BR>Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).<BR>Mealing泡点.<BR>Mean Time To Failure (MTTF)故障前可用之平均时数.<BR>Measling白点.<BR>Mechanical Stretcher机械式张网机.<BR>Mechanical Warp机械式缠绕.<BR>Mechanism机理.<BR>Membrane Switch薄膜开关.<BR>Meniscograph Test弧面状沾锡试验.<BR>Meniscus弯月面.<BR>Mercury Vaper Lamp汞气灯.<BR>Mesh Count纲目数.<BR>Metal Halide Lamp 金属卤素灯.<BR>Metallization金属 化.<BR>Metallized Fabric金属化纲布.<BR>Micelle微胞.<BR>Micro Wire Board微封线板.<BR>Micro-electronios微电子.<BR>Microetching微蚀.<BR>Microsectioning微切片法.<BR>Microstrip 微条.<BR>Microstrip Line微条线,微带线.<BR>Microthrowing Power微分布力.<BR>Microwave微波.<BR>Migration迁移.<BR>Migration Rate迁移率.<BR>Mil英丝.<BR>Minimum Annular Ring孔环下限.<BR>Minimum Electrical Spacing电性间距下限.<BR>Minor Weave Direction次要织向.<BR>Misregistration 对不准度.<BR>Mixed Componmt Mounting Technology混合零件之组装技术.<BR>Modem调变及解调器.<BR>Modification修改.<BR>Module模块.<BR>Modulus of Elasticity弹性系数.<BR>Moisture and Insulation Resistance Test湿气与绝缘电阻试验.<BR>Mold Release 脱模剂,离型剂.<BR>Mole摩尔.<BR>Monofilament单丝.<BR>Mother Board主机板,母板.<BR>Moulded Circuit模造立体电路机.<BR>Mounting Hole安装孔.<BR>Mounting Hole组装孔,机装孔.<BR>Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).<BR>Multi-Chip-Module(MCM)多芯片芯片模块.<BR>Multiwiring Board (or Discrete Wiring Board)复线板.<BR> *****N*****<BR>N.C.数值控制.<BR>Nail Head钉头.<BR>Near IR近红外线.<BR>Negative负片,钻尖的第一面外缘变窄.<BR>Negative Etch-back反回蚀.<BR>Negative Stencil负性感光膜.<BR>Negative-Acting Resist负性作用之阻剂.<BR>Network纲状元件.<BR>Newton牛顿.<BR>Newton Ring 牛顿环.<BR>Newtonian Liquid牛顿流体.<BR>Nick缺口.<BR>N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.<BR>Noble Metal Paste贵金属印膏.<BR>Node节点.<BR>Nodule节瘤.<BR>Nomencleature标示文字符号.<BR>Nominal Cured Thickness标示厚度.<BR>Non-Circular Land非圆形孔环焊垫.<BR>Non-flammable非燃性.<BR>Non-wetting不沾锡.<BR>Normal Concentration (Strength)标准浓度,当量浓度.<BR>Normal Distribution常态分布.<BR>Novolac酯醛树脂.<BR>Nucleation , Nucleating核化.<BR>Numerical Control数值控制.<BR>Nylon尼龙.<BR> *****O*****<BR>Occlusion吸藏.<BR>Off-Contact架空.<BR>Offset第一面大小不均.<BR>OFHC(Oxyen Free High Conductivity)无氧高导电铜.<BR>Ohm欧姆.<BR>Oilcanning盖板弹动.<BR>OLB(Outer Lead Bond)外引脚结合.<BR>Oligomer寡聚物.<BR>Omega Meter离子污染检测仪.<BR>Omega Wave振荡波.<BR>On-Contact Printing密贴式印刷.<BR>Opaquer不透明剂,遮光剂.<BR>Open Circuits断线.<BR>Optical Comparater光学对比器(光学放大器.)<BR>Optical Density光密度.<BR>Optical Inspection光学检验.<BR>Optical Instrument光学仪器.<BR>Organic Solderability Preservatives (OSP)有机保焊剂.<BR>Osmosis渗透.<BR>Outgassing出气,吹气.<BR>Outgrowth悬出,横出,侧出.<BR>Output产出,输出.<BR>Overflow溢流.<BR>Overhang总悬空.<BR>Overlap 钻尖点分离.<BR>Overpotantial(Over voltage)过电位,过电压.<BR>Oxidation氧化.<BR>Oxygen Inhibitor氧化抑制剂.<BR>Ozone Depletion臭氧层耗损.<BR> *****P*****<BR>Packaging封装,构装.<BR>Pad焊垫,圆垫.<BR>Pad Master圆垫底片.<BR>Pads Only Board唯垫板.<BR>Palladium钯.<BR>Panel制程板.<BR>Panel Plating全板镀铜.<BR>Panel Process全板电镀法.<BR>Paper Phenolic纸质酚醛树脂(板材).<BR>Parting Agent脱膜剂.<BR>Passivation钝化 ,钝化外理.<BR>Passive Device (Component)被动组件(零件)<BR>Paste膏,糊.<BR>Pattern板面图形.<BR>Pattern Plating线路电镀.<BR>Pattern Process线路电镀法.<BR>Peak Voltage峰值电压.<BR>Peel Strength抗撕强度.<BR>Periodic Reverse (PR) Current周期性反电流.<BR>Peripheral周边附属设备.<BR>Permeability透气性,导磁率.<BR>Permittivity诱电率,透电率.<BR>pH Value酸碱值.<BR>Phase相.<BR>Phase Diagram相图.<BR>Phenolic酚醛树脂.<BR>Photofugitive感光褪色.<BR>Photographic film感光成像之底片.<BR>Photoinitiator感光启始剂.<BR>Photomask光罩.<BR>Photoplotter, Plotter光学绘图机.<BR>Photoresist光阻.<BR>Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工.<BR>Phototool底片.<BR>Pick and Place拾取与放置.<BR>Piezoelectric压电性.<BR>Pin 插脚,插梢,插针.<BR>Pin Grid Array (PGA)矩阵式针脚对装.<BR>Pinhole针孔.<BR>Pink Ring粉红圈.<BR>Pitch跨距,脚距,垫距,线距.<BR>Pits凹点.<BR>Plain Weave平织.<BR>Plasma电浆.<BR>Plasticizers可塑剂,增塑剂. Plated Through Hole镀通孔.<BR>Platen热盘.<BR>Plating镀.<BR>Plotting标绘.<BR>Plowing犁沟.<BR>Plug插脚,塞柱.<BR>Ply层,股.<BR>Pneumatic Stretcher气动拉伸器.<BR>Pogo Pin伸缩探针.<BR>Point 钻尖.<BR>Point Angle钻尖面.<BR>Point Source Light点状光源.<BR>Poise泊."粘滞度"单位=1dyne*sec/cm2.<BR>Polar Solvent极性溶剂.<BR>Polarity电极性.<BR>Polarization分极,极化.<BR>Polarizing Slot偏槽.<BR>Polyester Films聚酯类薄片.<BR>Polymer Thick Film (PTF)厚膜糊.<BR>Polymerization聚合.<BR>Polymide(PI)聚亚醯胺.<BR>Popcorn Effect爆米花效应.<BR>Porcelain瓷材,瓷面.<BR>Porosity Test疏孔度试验.<BR>Positive Acting Resist正性光阻剂.<BR>Post Cure后续硬化,后烤.<BR>Post Separation后期分离,事后公离.<BR>Pot Life运用期,锅中寿命.<BR>Potting铸封,模封.<BR>Power Supply电源供应器.<BR>Preform 预制品.<BR>Preheat预热.<BR>Prepreg胶片,树脂片.<BR>Press Plate钢板.<BR>Press-Fit Contact挤入式接触.<BR>Pressure Foot 压力脚.<BR>Pre-tinning预先沾锡.<BR>Primary Image线路成像.<BR>Print Through压透,过度挤压..<BR>Probe探针.<BR>Process Camera制程用照像机.<BR>Process Window操作范围.<BR>Production Master生产底片.<BR>Profile轮廓,部面图,升温曲线图棱线.<BR>Propagation传播.<BR>Propagation Delay传播延迟.<BR>Puddle Effect水坑效应.<BR>Pull Away拉离.<BR>Pulse Plating脉冲电镀法.<BR>Pumice Powder 浮石粉.<BR>Punch冲切.<BR>Purge, Purging净空,净洗.<BR>Purple Plague紫疫(金与铝的共化物层).<BR>Pyrolysis热裂解,高温分解.<BR> *****Q*****<BR>Quad Flat Pack (QFP)方扁形封装体.<BR>Qualification Agency资格认证机构.<BR>Qualification Inspection资格检验.<BR>Qualified Products List合格产品(供应者)名单.<BR>Qualitative Analysis定性分析.<BR>Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板).<BR>Quantitative Analysis定量分析.<BR>Quench 淬火,骤冷.<BR>Quick Disconnect快速接头.<BR>Quill纬纱绕轴.<BR> *****R*****<BR>Rack 挂架.<BR>Radial Lead放射状引脚.<BR>Radio Frequency Interference (RFI)射频干扰.<BR>Rake Angle抠角,耙角.<BR>Rated Temperature, Voltage额定温度,额定电压.<BR>Reactance电抗.<BR>Real Estate底材面,基板面.<BR>Real Time System 实时系统.<BR>Reclaiming再生,再制.<BR>Rediometer辐射计,光度计.<BR>Reel to Reel卷轮(盘)式操作.<BR>Reference Dimension参考尺度.<BR>Reference Edge参考边缘.<BR>Reflection反射.<BR>Reflow Soldering重熔焊接,熔焊.<BR>Refraction折射.<BR>Refractive Index折射率.<BR>Register Mark对准用标记.<BR>Registration对准度.<BR>Reinforcement补强物.<BR>Rejection剔退,拒收.<BR>Relamination(Re-Lam)多层板压合.<BR>Relaxation松弛.缓和.<BR>Relay继电器.<BR>Release Agent, Release Sheets脱模剂,离模剂.<BR>Reliability可靠度,可信度.<BR>Relief Angle浮角.<BR>Repair修理.<BR>Resin Coated Copper Foil背胶铜箔.<BR>Resin Content胶含量,树脂含量.<BR>Resin Flow胶流量,树脂流量.<BR>Resin Recession树脂下陷.<BR>Resin Rich Area 多胶区,树脂丰富区.<BR>Resin Smear胶(糊)渣.<BR>Resin Starve Area缺胶区,树脂缺乏区.<BR>Resist阻膜,阻剂.<BR>Resistivity电阻系数,电阻率.<BR>Resistor电阻器,电阻.<BR>Resistor Drift电阻漂移.<BR>Resistor Paste电阻印膏.<BR>Resolution解像,解像度,分辨率.<BR>Resolving Power解析(像)力,分辨力.<BR>Reverse Current Cleaning反电流(电解)清洗.<BR>Reverse Etchback反回蚀.<BR>Reverse Image负片影像(阻剂).<BR>Reverse Osmosis (RO)反(逆渗透).<BR>Reversion反转,还原.<BR>Revision修正版.改订版.<BR>Rework(ing)重工,再加工.<BR>Rhology流变学,流变性质.<BR>Ribbon Cable圆线缆带.<BR>Rigid-Flex Printed Board硬软合板.<BR>Ring 套环.<BR>Rinsing水洗,冲洗.<BR>Ripple纹波(指整流器所输出电流中不稳定成分).<BR>Rise Time上升时间.<BR>Roadmap 线路与零件之布局图.<BR>Robber辅助阴极.<BR>Roller Coating辊轮涂布.<BR>Roller Coating滚动涂布法.<BR>Roller Cutter辊切机.<BR>Roller Tinning辊锡法,滚锡法.<BR>Rosin松香.<BR>Rotary Dip Test摆动沾锡试验.<BR>Routing切外型.<BR>Runout偏转,累绩距差.<BR>Rupture迸裂.<BR> *****S*****<BR>Sacrificial Protection牺牲性保护层.<BR>Salt Spray Test盐雾试验.<BR>Sand Blast喷砂.<BR>Saponification皂化作用.<BR>Saponifier皂化剂.<BR>Satin Finish缎面处理.<BR>Scaled Flow Test比例流量实验.<BR>Schemetic Diagram电路概略图.<BR>ScoringV型刻槽.<BR>Scratch刮痕.<BR>Screen Printing纲版印刷.<BR>Screenability纲印能力.<BR>Scrubber磨刷机,磨刷器.<BR>Scum透明残膜.<BR>Sealing封孔.<BR>Secondary Side第二面 .<BR>Seeding下种.<BR>Selective Plating选择性电镀.<BR>Self-Extinguishing自熄性.<BR>Selvage布边.<BR>Semi-Additive Process半加成制程.<BR>Semi-Conductor半导体.<BR>Sensitizing敏化.<BR>Separable Component Part可分离式零件.<BR>Separator Plate隔板, 钢板.<BR>Sequential Lamination接续性压合法.<BR>Sequestering Agent螯合剂.<BR>Shadowing阴影,回蚀死角.<BR>Shank钻针柄部.<BR>Shear Strength 抗剪强度.<BR>Shelf Life储龄.<BR>Shield遮蔽.<BR>Shore Hardness萧氏硬度.<BR>Short短路.<BR>Shoulder Angle肩斜角.<BR>Shunt分路.<BR>Side Wall侧壁.<BR>Siemens电阻值.<BR>Sigma (Standard Deviation)标准差.<BR>Signal讯号.<BR>Silane硅烷.<BR>Silica Gel硅胶砂.<BR>Silicon硅.<BR>Silicone硅铜.<BR>Silk Screen纲版印刷,丝纲印刷.<BR>Silver Migration银迁移.<BR>Silver Paste 银膏.<BR>Single-In-Line Package(SIP)单边插脚封装体.<BR>Sintering烧结.<BR>Sizing上胶,上浆.<BR>Sizing上浆处理.<BR>Skin Effect集肤效应 (高频下,电流在传递时多集中在导体<BR> 表面,使得道线内部通过电流甚少, 造成内部导体<BR>浪费,并也使得表面导体部分电阻升高.<BR>Skip Printing, Skip Plating漏印,漏镀.<BR>Skip Solder 缺锡, 漏焊.<BR>Slashing浆经.<BR>Sleeve Jint套接.<BR>Sliver边丝,边余.<BR>Slot, Slotting槽口.<BR>Sludge于泥.<BR>Slump塌散.<BR>Slurry稠浆,悬浮浆.<BR>Small Hole小孔.<BR>Smear胶渣.<BR>Smudging锡点沾污.<BR>Snap-off弹回高度.<BR>Socket插座.<BR>Soft Contact轻触.<BR>Soft Glass 软质玻璃(铅玻璃).<BR>Solder焊锡. Solder Ball锡球.<BR>Solder Bridging锡桥.<BR>Solder Bump 焊锡凸块.<BR>Solder Column Package锡柱脚封装法.<BR>Solder Connection焊接.<BR>Solder Cost焊锡着层.<BR>Solder Dam锡堤.<BR>Solder Fillet填锡.<BR>Solder Levelling喷锡,热风整平.<BR>Solder Masking(S/M)防焊膜绿漆.<BR>Solder Paste锡膏.<BR>Solder Plug锡塞(柱).<BR>Solder Preforms预焊料.<BR>Solder Projection焊锡突点.<BR>Solder Sag 焊锡垂流物.<BR>Solder Side焊锡面.<BR>Solder Spatter溅锡.<BR>Solder Splash贱锡.<BR>Solder Spread Test散锡试验.<BR>Solder Webbing锡纲.<BR>Solder Webbing锡纲.<BR>Solder Wicking渗锡,焊锡之灯芯效应.<BR>Solderability可焊性.<BR>Soldering软焊,焊接.<BR>Soldering Fluid, Soldering Oil助焊液,护焊油.<BR>Solid Content固体含量,固形分.<BR>Solidus Line固相线.<BR>Spacing间距.<BR>Span跨距.<BR>Spark Over闪络.<BR>Specific Heat 比热.<BR>Specification (Spec)规范,规格.<BR>Specimen样品,试样.<BR>Spectrophotometry分光光度计检测法.<BR>Spindle主轴,钻轴.<BR>Spinning Coating自转涂布.<BR>Splay斜钻孔.<BR>Spray Coating喷着涂装.<BR>Spur底片图形边缘突出.<BR>Sputtering溅射.<BR>Squeege刮刀.<BR>Stagger Grid蹒跚格点.<BR>Stalagometer滴管式表面张力计.<BR>Stand-off Terminals直立型端子.<BR>Starvation缺胶.<BR>Static Eliminator静电消除器.<BR>Steel Rule Die(钢)刀模.<BR>Stencil版膜.<BR>Step and Repeat逐次重复曝光.<BR>Step Plating梯阶式镀层.<BR>Step Tablet阶段式曝光表.<BR>Stiffener补强条(板).<BR>Stop Off防镀膜, 阻剂.<BR>Strain变形,应变.<BR>Strand绞(指由许多股单丝集束并旋扭而成的丝束).<BR>Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电<BR> 由整流器所提供,应在阳极板与被镀件之间的汇<BR>电杆与槽体液体中流通,但有时少部分电流也可能会<BR>从槽体本身或加热器上迷走,漏失).<BR>Stress Corrosion应力腐蚀.<BR>Stress Relief消除应力.<BR>Strike预镀.<BR>Stringing拖尾.<BR>Stripline条线.<BR>Stripper剥除液(器).<BR>Substractive Process减成法.<BR>Substrate底材.<BR>Supper Solder超级焊锡.<BR>Supported Hole(金属)支助通孔.<BR>Surface Energy表面能.<BR>Surface Insulation Resistance表面绝缘电阻.<BR>Surface Mount Device 表面粘装组件.<BR>Surface Mounting Technology (SMT)表面粘装技术.<BR>Surface Resistivity表面电阻率.<BR>Surface Speed钻针表面速度.<BR>Surface Tension表面张力.<BR>Surfactant表面润湿剂.<BR>Surge突流,突压.<BR>Swaged Lead压扁式引脚.<BR>Swelling Agents, Sweller膨松剂.<BR>Swimming 线路滑离.<BR>Synthetic Resin合成树脂.<BR> *****T*****<BR>Tab接点,金手指.<BR>Taber Abraser泰伯磨试器.<BR>Tackiness粘着性, 粘手性.<BR>Tape Automatic Bonding (TAB)卷带自动结合.<BR>Tape Casting 带状铸材.<BR>Tape Test撕胶带试验.<BR>Tape Up Master原始手贴片.<BR>Taped Components卷带式连载组件.<BR>Taper Pin Gauge锥状孔规.<BR>Tarnish污化.<BR>Tarnish 污化, 污着.<BR>Teflon铁氟龙(聚4氟乙烯).<BR>Telegraphing浮印,隐印.<BR>Temperature Profile温度曲线.<BR>Template模板.<BR>Tensile Strength抗拉强度.<BR>Tensiomenter张力计.<BR>Tenting盖孔法.<BR>Terminal端子.<BR>Terminal Clearance端子空环.<BR>Tetra-Etch氟树脂蚀粗剂.<BR>Tetrafunctional Resin四功能树脂.<BR>Thermal Coefficient of Expansion (TCE)热膨胀系数.<BR>Thermal Conductivity导热率.<BR>Thermal Cycling热循环,热震荡.<BR>Thermal Mismstch感热失谐.<BR>Thermal Relief散热式镂空.<BR>Thermal Via导热孔.<BR>Thermal Zone感热区.<BR>Thermocompression Bonding热压结合.<BR>Thermocouple热电偶.<BR>Thermode发热体.<BR>Thermode Soldering热模焊接法.<BR>Thermogravimetric Analysis, (TGA)热重分析法.<BR>Thermomechanical Analysis (TMA)热机分析法.<BR>Thermoplastic热塑性.<BR>Thermosetting热固性.<BR>Thermosonic Bonding热超音波结合.<BR>Thermount聚醯胺短纤席材.<BR>Thermo-Via导热孔.<BR>Thick Film Circuit厚膜电路.<BR>Thief辅助阳极.<BR>Thin Copper Foil薄铜箔.<BR>Thin Core薄基板.<BR>Thin Film Technology薄膜技术.<BR>Thin Small Outline Package(TSOP)薄小型绩体电路器.<BR>Thinner调薄剂.<BR>Thixotropy抗垂流性,摇变性.<BR>Three Point Bending三点压弯试验.<BR>Three-Layer Carrier三层式载体.<BR>Threshold Limit Value (TLV)极限值.<BR>Through Hole Mounting通孔插装.<BR>Through Put物流量,物料通过量.<BR>Throwing Power分布力.<BR>Tie Bar分流条.<BR>Tin Drift锡量漂飘失.<BR>Tin Immersion浸镀锡.<BR>Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃<BR>时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".<BR>Tin Whishers锡须.<BR>Tinning热沾焊锡.<BR>Tolerance公差.<BR>Tombstoning墓碑效应.<BR>Tooling Feature工具标示物.<BR>Topography表面地形.<BR>Torsion Strength抗扭强度.<BR>Touch Up触修,简修.<BR>Trace 线路,导线.<BR>Traceability追溯性,可溯性.<BR>Transducer转能器.<BR>Transfer Bump移用式突块.<BR>Transfer Laminatied Circuit转压式线路.<BR>Transfer Soldering移焊法.<BR>Transistor晶体管.<BR>Translucency半透性.<BR>Transmission Line传输线.<BR>Transmittance透光率.<BR>Treament, Treating含浸处理.<BR>Treeing枝状镀物,镀须.<BR>Trim修整, 精修.<BR>Trim Line裁切线.<BR>Trimming修整,修边.<BR>True Position真位.<BR>Tungsten钨<BR>Tungsten Carbide碳化钨.<BR>Turnkey System包办式系统.<BR>Turret Solder Terminal塔立式焊接端子.<BR>Twill Weave斜织法.<BR>Twist板扭.<BR>Two Layer Carrier两层式载体.<BR> *****U*****<BR>UL Symbol(UL.为Under-Writers 保俭业试验所标志.<BR> Laboratories,INC)<BR>Ultimate Tensile Strength (UTS)极限抗拉强度.<BR>Ultra High Frequency (UHF)超高频率.<BR>Ultra Violet Curing (UV Curing)紫外线硬化.<BR>Ultrasonic Bonding超音波结合.<BR>Ultrasonic Cleaning超音波清洗.<BR>Ultrasonic Soldering超音波焊接.<BR>Unbalanced Transmission Line非平衡式传输线.<BR>Undercut, Undercutting侧蚀.<BR>Underplate底镀层.<BR>Universal Tester汛用型电测机.<BR>Unsupported Hole非镀通孔.<BR>Urea尿素.<BR>Urethane胺基甲酸乙脂.<BR> Vacuoles焊洞.<BR>Vacuum Evaporation(or Deposition)真空蒸镀法.<BR>Vacuum Lamination真空压合.<BR>Van Der Waals Force凡得华力.<BR>Vapor Blasting蒸汽喷砂.<BR>Vapor Degreasing蒸汽除油法.<BR>Vapor Phase Soldering气相焊接.<BR>Varnish凡力水,清漆(树脂之液态单体).<BR>V-cutV型切槽.<BR>Very Large-Scale Integration(VLSI)极大绩体电路器.<BR>Via Hole 导通孔.<BR>Vickers Hardness维氏硬度.<BR>Viscosity粘滞度,粘度.<BR>Vision Systems视觉系统.<BR>Visual Examination目视检验.<BR>Void 破洞,空洞.<BR>Volatile Content挥发份含量.<BR>Voltage电压.<BR>Voltage Breakdown崩溃电压.<BR>Voltage Drop 电压降落.<BR>Voltage Efficiency电压效率.<BR>Voltage Plane电压层.<BR>Voltage Plane Clearance电压层的空环.<BR>Volume Resistivity体绩电阻率.<BR>Volume Resistivity体绩电阻率.<BR>Volumetric Analysis容量分析法.<BR>Vulcanization交联,硫化.<BR> *****W*****<BR>Wafer晶圆.<BR>Waive暂准过关,暂不检查.<BR>Warp Size 浆经处理.<BR>Warp, Warpage板弯.<BR>Washer垫圈.<BR>Waste Treatment废弃处理.<BR>Water Absorption吸水性.<BR>Water Break水膜破散,水破.<BR>Water Mark水印. <BR>Watt瓦特.<BR>Watts Bath瓦兹镀镍液.<BR>Wave Guide导波管.<BR>Wave Soldering波焊.<BR>Waviness 波纹,波度.<BR>Wear Resistance耐磨性,耐磨度.<BR>Weatherability耐候性.<BR>Weave Eposure织纹显露.<BR>Weave Texture织纹隐现.<BR>Web蹼部.<BR>Wedge Bond 楔形结合点.<BR>Wedge Void楔形缺口(破口).<BR>Weft Yarn纬纱.<BR>Welding熔接.<BR>Wet Blasting湿喷砂.<BR>Wet Lamination湿压膜法.<BR>Wet Process湿式制程.<BR>Wetting Agent润湿剂.<BR>Wetting Balance沾锡天平.<BR>Wetting Balance沾锡,沾湿.<BR>Whirl Brush旋涡式磨刷法.<BR>Whirl Coating旋涡涂布法.<BR>Whisker晶须.<BR>White Residue白色残渣.<BR>White Spot白点.<BR>Wicking灯蕊效应.<BR>Window操作范围,传动齿孔.<BR>Wiping Action 滑动接触(导电).<BR>Wire Bonding打线结合.<BR>Wire Gauge线规.<BR>Wire Lead金属线脚.<BR>Wire Pattern布线图形.<BR>Wire Wrap绕线互连.<BR>Working Master工作母片.<BR>Working Time (Life)堪用时间.<BR>Workmanship 手艺,工艺水平,制作水准.<BR>Woven Cable扁平编线.<BR>Wrinkle皱折, 皱纹.<BR>Wrought Foil锻碾金属箔.<BR> *****X*****<BR>X AxisX轴.<BR>X-Ray X光.<BR>X-Ray FluorescenceX萤光.<BR> *****Y*****<BR>Yarn纱线.<BR>Y-AxisY轴.<BR>Yield良品率,良率,产率.<BR>Yield Point屈服点.<BR> *****Z*****<BR>Z-AxisZ轴.<BR>Zero Centering中心不变(叠合法).<BR>Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.<BR><BR>=====================================================<BR>[分享]PCB专业英译术语<BR>一、 综合词汇 <BR>1、 印制电路：printed circuit <BR>2、 印制线路：printed wiring <BR>3、 印制板：printed board <BR>4、 印制板电路：printed circuit board (PCB) <BR>5、 印制线路板：printed wiring board(PWB) <BR>6、 印制组件：printed component <BR>7、 印制接点：printed contact <BR>8、 印制板装配：printed board assembly <BR>9、 板：board <BR>10、 单面印制板：single-sided printed board(SSB) <BR>11、 双面印制板：double-sided printed board(DSB) <BR>12、 多层印制板：mulitlayer printed board(MLB) <BR>13、 多层印制电路板：mulitlayer printed circuit board <BR>14、 多层印制线路板：mulitlayer prited wiring board <BR>15、 刚性印制板：rigid printed board <BR>16、 刚性单面印制板：rigid single-sided printed borad <BR>17、 刚性双面印制板：rigid double-sided printed borad <BR>18、 刚性多层印制板：rigid multilayer printed board <BR>19、 挠性多层印制板：flexible multilayer printed board <BR>20、 挠性印制板：flexible printed board <BR>21、 挠性单面印制板：flexible single-sided printed board <BR>22、 挠性双面印制板：flexible double-sided printed board <BR>23、 挠性印制电路：flexible printed circuit (FPC) <BR>24、 挠性印制线路：flexible printed wiring <BR>25、 刚性印制板：flex-rigid printed board, rigid-flex printed board <BR>26、 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed <BR>27、 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board <BR>28、 齐平印制板：flush printed board <BR>29、 金属芯印制板：metal core printed board <BR>30、 金属基印制板：metal base printed board <BR>31、 多重布线印制板：mulit-wiring printed board <BR>32、 陶瓷印制板：ceramic substrate printed board <BR>33、 导电胶印制板：electroconductive paste printed board <BR>34、 模塑电路板：molded circuit board <BR>35、 模压印制板：stamped printed wiring board <BR>36、 顺序层压多层印制板：sequentially-laminated mulitlayer <BR>37、 散线印制板：discrete wiring board <BR>38、 微线印制板：micro wire board <BR>39、 积层印制板：buile-up printed board <BR>40、 积层多层印制板：build-up mulitlayer printed board (BUM) <BR>41、 积层挠印制板：build-up flexible printed board <BR>42、 表面层合电路板：surface laminar circuit (SLC) <BR>43、 埋入凸块连印制板：B2it printed board <BR>44、 多层膜基板：multi-layered film substrate(MFS) <BR>45、 层间全内导通多层印制板：ALIVH multilayer printed board <BR>46、 载芯片板：chip on board (COB) <BR>47、 埋电阻板：buried resistance board <BR>48、 母板：mother board <BR>49、 子板：daughter board <BR>50、 背板：backplane <BR>51、 裸板：bare board <BR>52、 键盘板夹心板：copper-invar-copper board <BR>53、 动态挠性板：dynamic flex board <BR>54、 静态挠性板：static flex board <BR>55、 可断拼板：break-away planel 56、 电缆：cable <BR>57、 挠性扁平电缆：flexible flat cable (FFC) <BR>58、 薄膜开关：membrane switch <BR>59、 混合电路：hybrid circuit <BR>60、 厚膜：thick film <BR>61、 厚膜电路：thick film circuit <BR>62、 薄膜：thin film <BR>63、 薄膜混合电路：thin film hybrid circuit <BR>64、 互连：interconnection <BR>65、 导线：conductor trace line <BR>66、 齐平导线：flush conductor <BR>67、 传输线：transmission line <BR>68、 跨交：crossover <BR>69、 板边插头：edge-board contact <BR>70、 增强板：stiffener <BR>71、 基底：substrate <BR>72、 基板面：real estate <BR>73、 导线面：conductor side <BR>74、 组件面：component side <BR>75、 焊接面：solder side <BR>76、 印制：printing <BR>77、 网格：grid <BR>78、 图形：pattern <BR>79、 导电图形：conductive pattern <BR>80、 非导电图形：non-conductive pattern <BR>81、 字符：legend <BR>82、 标志：mark <BR> <BR>作者：ilww 2004-11-10 16:18:00)<BR><BR><BR>二、 基材： <BR>1、 基材：base material <BR>2、 层压板：laminate <BR>3、 覆金属箔基材：metal-clad bade material <BR>4、 覆铜箔层压板：copper-clad laminate (CCL) <BR>5、 单面覆铜箔层压板：single-sided copper-clad laminate <BR>6、 双面覆铜箔层压板：double-sided copper-clad laminate <BR>7、 复合层压板：composite laminate <BR>8、 薄层压板：thin laminate <BR>9、 金属芯覆铜箔层压板：metal core copper-clad laminate <BR>10、 金属基覆铜层压板：metal base copper-clad laminate <BR>11、 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film <BR>12、 基体材料：basis material <BR>13、 预浸材料：prepreg <BR>14、 粘结片：bonding sheet <BR>15、 预浸粘结片：preimpregnated bonding sheer <BR>16、 环氧玻璃基板：epoxy glass substrate <BR>17、 加成法用层压板：laminate for additive process <BR>18、 预制内层覆箔板：mass lamination panel <BR>19、 内层芯板：core material <BR>20、 催化板材：catalyzed board ,coated catalyzed laminate <BR>21、 涂胶催化层压板：adhesive-coated catalyzed laminate <BR>22、 涂胶无催层压板：adhesive-coated uncatalyzed laminate <BR>23、 粘结层：bonding layer <BR>24、 粘结膜：film adhesive <BR>25、 涂胶粘剂绝缘薄膜：adhesive coated dielectric film <BR>26、 无支撑胶粘剂膜：unsupported adhesive film <BR>27、 覆盖层：cover layer (cover lay) <BR>28、 增强板材：stiffener material <BR>29、 铜箔面：copper-clad surface <BR>30、 去铜箔面：foil removal surface <BR>31、 层压板面：unclad laminate surface <BR>32、 基膜面：base film surface <BR>33、 胶粘剂面：adhesive faec <BR>34、 原始光洁面：plate finish <BR>35、 粗面：matt finish <BR>36、 纵向：length wise direction <BR>37、 模向：cross wise direction <BR>38、 剪切板：cut to size panel <BR>39、 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) <BR>40、 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) <BR>41、 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates <BR>42、 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates <BR>43、 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates <BR>44、 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates <BR>45、 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates <BR>46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates <BR>47、 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates <BR>48、 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates <BR>49、 超薄型层压板：ultra thin laminate <BR>50、 陶瓷基覆铜箔板：ceramics base copper-clad laminates <BR>51、 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates <BR>作者：ilww 2004-11-10 16:19:00)<BR><BR><BR>三、 基材的材料 <BR>1、 A阶树脂：A-stage resin <BR>2、 B阶树脂：B-stage resin <BR>3、 C阶树脂：C-stage resin <BR>4、 环氧树脂：epoxy resin <BR>5、 酚醛树脂：phenolic resin <BR>6、 聚酯树脂：polyester resin <BR>7、 聚酰亚胺树脂：polyimide resin <BR>8、 双马来酰亚胺三嗪树脂：bismaleimide-triazine resin <BR>9、 丙烯酸树脂：acrylic resin <BR>10、 三聚氰胺甲醛树脂：melamine formaldehyde resin <BR>11、 多官能环氧树脂：polyfunctional epoxy resin <BR>12、 溴化环氧树脂：brominated epoxy resin <BR>13、 环氧酚醛：epoxy novolac <BR>14、 氟树脂：fluroresin <BR>15、 硅树脂：silicone resin <BR>16、 硅烷：silane <BR>17、 聚合物：polymer <BR>18、 无定形聚合物：amorphous polymer <BR>19、 结晶现象：crystalline polamer <BR>20、 双晶现象：dimorphism <BR>21、 共聚物：copolymer <BR>22、 合成树脂：synthetic <BR>23、 热固性树脂：thermosetting resin <BR>24、 热塑性树脂：thermoplastic resin <BR>25、 感旋光性树脂：photosensitive resin <BR>26、 环氧当量：weight per epoxy equivalent (WPE) <BR>27、 环氧值：epoxy value <BR>28、 双氰胺：dicyandiamide <BR>29、 粘结剂：binder <BR>30、 胶粘剂：adesive <BR>31、 固化剂：curing agent <BR>32、 阻燃剂：flame retardant <BR>33、 遮光剂：opaquer <BR>34、 增塑剂：plasticizers <BR>35、 不饱和聚酯：unsatuiated polyester <BR>36、 聚酯薄膜：polyester <BR>37、 聚酰亚胺薄膜：polyimide film (PI) <BR>38、 聚四氟乙烯：polytetrafluoetylene (PTFE) <BR>39、 聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP) <BR>40、 增强材料：reinforcing material <BR>41、 玻璃纤维：glass fiber <BR>42、 E玻璃纤维：E-glass fibre <BR>43、 D玻璃纤维：D-glass fibre <BR>44、 S玻璃纤维：S-glass fibre <BR>45、 玻璃布：glass fabric <BR>46、 非织布：non-woven fabric <BR>47、 玻璃纤维垫：glass mats <BR>48、 纱线：yarn <BR>49、 单丝：filament <BR>50、 绞股：strand <BR>51、 纬纱：weft yarn <BR>52、 经纱：warp yarn <BR>53、 但尼尔：denier <BR>54、 经向：warp-wise 55、 纬向：weft-wise, filling-wise <BR>56、 织物经纬密度：thread count <BR>57、 织物组织：weave structure <BR>58、 平纹组织：plain structure <BR>59、 坏布：grey fabric <BR>60、 稀松织物：woven scrim <BR>61、 弓纬：bow of weave <BR>62、 断经：end missing <BR>63、 缺纬：mis-picks <BR>64、 纬斜：bias <BR>65、 折痕：crease <BR>66、 云织：waviness <BR>67、 鱼眼：fish eye <BR>68、 毛圈长：feather length <BR>69、 厚薄段：mark <BR>70、 裂缝：split <BR>71、 捻度：twist of yarn <BR>72、 浸润剂含量：size content <BR>73、 浸润剂残留量：size residue <BR>74、 处理剂含量：finish level <BR>75、 浸润剂：size <BR>76、 偶联剂：couplint agent <BR>77、 处理织物：finished fabric <BR>78、 聚酰胺纤维：polyarmide fiber <BR>79、 聚酯纤维非织布：non-woven polyester fabric <BR>80、 浸渍绝缘纵纸：impregnating insulation paper <BR>81、 聚芳酰胺纤维纸：aromatic polyamide paper <BR>82、 断裂长：breaking length <BR>83、 吸水高度：height of capillary rise <BR>84、 湿强度保留率：wet strength retention <BR>85、 白度：whitenness <BR>86、 陶瓷：ceramics <BR>87、 导电箔：conductive foil <BR>88、 铜箔：copper foil <BR>89、 电解铜箔：electrodeposited copper foil (ED copper foil) <BR>90、 压延铜箔：rolled copper foil <BR>91、 退火铜箔：annealed copper foil <BR>92、 压延退火铜箔：rolled annealed copper foil (RA copper foil) <BR>93、 薄铜箔：thin copper foil <BR>94、 涂胶铜箔：adhesive coated foil <BR>95、 涂胶脂铜箔：resin coated copper foil (RCC) <BR>96、 复合金属箔：composite metallic material <BR>97、 载体箔：carrier foil <BR>98、 殷瓦：invar <BR>99、 箔（剖面）轮廓：foil profile <BR>100、 光面：shiny side <BR>101、 粗糙面：matte side <BR>102、 处理面：treated side <BR>103、 防锈处理：stain proofing <BR>104、 双面处理铜箔：double treated foil <BR>作者：ilww 2004-11-10 16:20:00)<BR><BR><BR>四、 设计 <BR>1、 原理图：shematic diagram <BR>2、 逻辑图：logic diagram <BR>3、 印制线路布设：printed wire layout <BR>4、 布设总图：master drawing <BR>5、 可制造性设计：design-for-manufacturability <BR>6、 计算机辅助设计：computer-aided design.(CAD) <BR>7、 计算机辅助制造：computer-aided manufacturing.(CAM) <BR>8、 计算机集成制造：computer integrat manufacturing.(CIM) <BR>9、 计算机辅助工程：computer-aided engineering.(CAE) <BR>10、 计算机辅助测试：computer-aided test.(CAT) <BR>11、 电子设计自动化：electric design automation .(EDA) <BR>12、 工程设计自动化：engineering design automaton .(EDA2) <BR>13、 组装设计自动化：assembly aided architectural design. (AAAD) <BR>14、 计算机辅助制图：computer aided drawing <BR>15、 计算机控制显示：computer controlled display .(CCD) <BR>16、 布局：placement <BR>17、 布线：routing <BR>18、 布图设计：layout <BR>19、 重布：rerouting <BR>20、 模拟：simulation <BR>21、 逻辑模拟：logic simulation <BR>22、 电路模拟：circit simulation <BR>23、 时序模拟：timing simulation <BR>24、 模块化：modularization <BR>25、 布线完成率：layout effeciency <BR>26、 机器描述格式：machine descriptionm format .(MDF) <BR>27、 机器描述格式数据库：MDF databse <BR>28、 设计数据库：design database <BR>29、 设计原点：design origin <BR>30、 优化（设计）：optimization (design) <BR>31、 供设计优化坐标轴：predominant axis <BR>32、 表格原点：table origin <BR>33、 镜像：mirroring <BR>34、 驱动文件：drive file <BR>35、 中间文件：intermediate file <BR>36、 制造文件：manufacturing documentation <BR>37、 队列支撑数据库：queue support database <BR>38、 组件安置：component positioning <BR>39、 图形显示：graphics dispaly <BR>40、 比例因子：scaling factor <BR>41、 扫描填充：scan filling <BR>42、 矩形填充：rectangle filling <BR>43、 填充域：region filling <BR>44、 实体设计：physical design <BR>45、 逻辑设计：logic design <BR>46、 逻辑电路：logic circuit <BR>47、 层次设计：hierarchical design <BR>48、 自顶向下设计：top-down design <BR>49、 自底向上设计：bottom-up design <BR>50、 线网：net <BR>51、 数字化：digitzing <BR>52、 设计规则检查：design rule checking <BR>53、 走（布）线器：router (CAD) <BR>54、 网络表：net list <BR>55、 计算机辅助电路分析：computer-aided circuit analysis <BR>56、 子线网：subnet <BR>57、 目标函数：objective function <BR>58、 设计后处理：post design processing (PDP) <BR>59、 交互式制图设计：interactive drawing design <BR>60、 费用矩阵：cost metrix <BR>61、 工程图：engineering drawing <BR>62、 方块框图：block diagram <BR>63、 迷宫：moze <BR>64、 组件密度：component density <BR>65、 巡回售货员问题：traveling salesman problem <BR>66、 自由度：degrees freedom <BR>67、 入度：out going degree <BR>68、 出度：incoming degree <BR>69、 曼哈顿距离：manhatton distance <BR>70、 欧几里德距离：euclidean distance <BR>71、 网络：network <BR>72、 阵列：array <BR>73、 段：segment <BR>74、 逻辑：logic <BR>75、 逻辑设计自动化：logic design automation <BR>76、 分线：separated time <BR>77、 分层：separated layer <BR>78、 定顺序：definite sequenc<BR>作者：ilww 2004-11-10 16:21:00)<BR><BR><BR>五、 形状与尺寸： <BR>1、 导线（信道）：conduction (track) <BR>2、 导线（体）宽度：conductor width <BR>3、 导线距离：conductor spacing <BR>4、 导线层：conductor layer <BR>5、 导线宽度/间距：conductor line/space <BR>6、 第一导线层：conductor layer No.1 <BR>7、 圆形盘：round pad <BR>8、 方形盘：square pad <BR>9、 菱形盘：diamond pad <BR>10、 长方形焊盘：oblong pad <BR>11、 子弹形盘：bullet pad <BR>12、 泪滴盘：teardrop pad <BR>13、 雪人盘：snowman pad <BR>14、 V形盘：V-shaped pad <BR>15、 环形盘：annular pad <BR>16、 非圆形盘：non-circular pad <BR>17、 隔离盘：isolation pad <BR>18、 非功能连接盘：monfunctional pad <BR>19、 偏置连接盘：offset land <BR>20、 腹（背）裸盘：back-bard land <BR>21、 盘址：anchoring spaur <BR>22、 连接盘图形：land pattern <BR>23、 连接盘网格阵列：land grid array <BR>24、 孔环：annular ring 25、 组件孔：component hole <BR>26、 安装孔：mounting hole <BR>27、 支撑孔：supported hole <BR>28、 非支撑孔：unsupported hole <BR>29、 导通孔：via <BR>30、 镀通孔：plated through hole (PTH) <BR>31、 余隙孔：access hole <BR>32、 盲孔：blind via (hole) <BR>33、 埋孔：buried via hole <BR>34、 埋/盲孔：buried /blind via <BR>35、 任意层内部导通孔：any layer inner via hole (ALIVH) <BR>36、 全部钻孔：all drilled hole <BR>37、 定位孔：toaling hole <BR>38、 无连接盘孔：landless hole <BR>39、 中间孔：interstitial hole <BR>40、 无连接盘导通孔：landless via hole <BR>41、 引导孔：pilot hole <BR>42、 端接全隙孔：terminal clearomee hole <BR>43、 准表面间镀覆孔：quasi-interfacing plated-through hole <BR>44、 准尺寸孔：dimensioned hole <BR>45、 在连接盘中导通孔：via-in-pad <BR>46、 孔位：hole location <BR>47、 孔密度：hole density <BR>48、 孔图：hole pattern <BR>49、 钻孔图：drill drawing <BR>50、 装配图：assembly drawing <BR>51、 印制板组装图：printed board assembly drawing <BR>52、 参考基准：datum referan <BR></FONT></FONT>
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